On July 9, 2026, 3SP Technologies announces a new purchase order to Riber, a French company specialized in molecular beam epitaxy equipment, on a passivation system. The system is scheduled to be received in 2027.
A subsidiary of the O-Net Communications Group, 3SP Technologies is a recognized designer and manufacturer of high-performance laser chips and modules for optical telecommunications networks and next-generation Datacom infrastructures. Its products support the continuous growth of global data traffic and the rapid expansion of AI-driven digital architectures.
« This new order will significantly increase the production capacity of 3SP Technologies’ 980 nm high power laser diodes. This will allow 3SP Technologies to strengthen its customers’ support to better satisfy booming demands on such products for data center interconnects, Hyper-rails system and other industrial applications, and reinforce 3SP Technologies leading position in this growing market. It reflects indeed the lasting confidence of 3SP to Riber, with more than two decades of partnership.”, said Austin Na, Chairman of 3SP Technologies, and Chairman and Chief Executive Officer of O-Net Communications Group.
