Introduction
3SP Technologies has a rich portfolio of state-of-the-art actives III-V devices suitable for both single mode and multi-mode fibers over a wide spectral range from 800nm up to 1600nm, over a wide set of optical powers ranging from 2mW to 30W and over a wide range of data rate from CW to 50Gb/s with demonstrated reliability both with laboratory data and field data.
This is the result of successful initial technology transfers from R&D labs or established industrials partners from several locations in France & in Europe followed by internal R&D programs to enhance product performance.
Strong Intellectual Propriety and talented technical staff
In addition to 3SP Technologies’ strong position regarding its entire technological heritage, the intellectual Property (IP) represents a strong asset as well as a protection barrier for our products and technologies. 3SP Technologies’ IP includes manufacturing, packaging and device technologies. To date, 3SP Technologies products are covered with more 100 granted or licensed patents.
Thanks to the nearby Paris-Saclay campus and Optical Valley network, more than 20% of 3SP Technologies workforce involves scientists and highly skilled engineers who are involved in advanced R&D and Engineering programs.
3SP Technologies’ team exceeds hundred employees specialized in :
Semiconductors manufacturing (wafer-fab planning, epitaxy, wafer-processing, bar passivation & coating, die & chip on submount processing, testing & screening),
Semiconductor engineering (new equipment, process & product introduction, database-oriented process & product yield control & analysis),
Semiconductor chip design & packaging R&D for end-to-end new product development including device numerical simulation, optical, micro-mechanical & thermal CAD tools, high frequency design & simulations softwares, R&D test lab (cw, pulsed & high frequency including SM & MM fiber optical transmission setup),
Semiconductor reliability (chip on submount ageing racks, thermal cycling & damp heat systems, failure analysis lab, reliability modelling & softwares)
Quality management & control
Unique manufacturing facility and 25 years of experience in optoelectronic technologies
3SP Technologies’ renowned optoelectronic chip manufacturing plant established in Nozay (25 km south of Paris) since 1994 is technologically unique in that it brings together both GaAs and InP technologies under the same roof.
The plant has 2,000 square meters of class 1,000 and 10,000 clean rooms and an annual production capacity exceeding 1,000 GaAs wafers and 1,000 InP wafers ranging from 3” to 4” diameter. It is equipped with the most advanced equipment and wafer or mirror processing technologies. On the front-end side this involves: MOVPE, GS-MBE, UV lithography, holographic lithography, RIBE, ICP, PECVD, DIBS, Evaporation, UHV Passivation, E-Beam Evap and IBD. On the back-end side, this involves automatic bar & chip probe testing, automatic wafer & bar dicing, automatic eutectic die bonding & wiring, automatic chip on submount testing & burn-in. To provide cost effective solutions packaging activities are outsourced to contract manufacturers located in low cost areas under 3SP Technologies full supervision..
Industrial know-how and everlasting values.
In 3SP Technologies’ history, the company was one of the top three leading optical components manufacturers. Having the technological and physical capability to handle all of these manufacturing elements provides significant advantages to 3SP Technologies’ customers: shorter lead times, better cost control, shorter development cycles and state-of-the art & reliability proven products.
3SP Technologies possess an end-to-end knowledge of the key technologies to design and manufacture laser and detector chips as well as active discrete modules. Its proven-technology platform and “building blocks” approach allows 3SP Technologies to market state-of-the-art products which are offering an unparalleled level of performances and reliability. 3SP Technologies will continue to use its outstanding technologies, expertise and innovation capacity to expand its industry-leading active and passive components product lines to meet the future demand of its customers.