Front-End Manufacturing
3SP Technologies manufacturing facilities include state-of-the-art clean rooms, highly-automated assembly and test equipment together with integrated information systems
Strong technical experience
More than 25 years expertise in optoelectronic chips & components design and manufacturing
Recognized product performances and reliability (lab & field data)
Complete and up-to-date equipment set and processes
Unique reliability proven “building block” approach
Broad “chips, CoS & packaged devices” product offering
Scalable production capacity
Technical customization, customer support and accountability
Stable business relationship
Fully deployed since 1994 and fully production stabilized
MOVPE & GS-MBE reactors
Wet oxidation
Dry (RIE, IBE, RIBE, ICP) & Wet etching
Dielectric PECVD
DIBS & e-beam metal deposition
UV & holographic Photo-lithography
UHV passivation
E-beam & IBD facet coating
Automatic wafer, bar & chip probe testing
Automatic eutectic die bonding & wiring
Automatic chip on submount testing benches & burn-in racks