PACKAGING
3SP Technologies has a renowned experience in high quality packaging design that requires seven areas of expertise:
Eutectic & glue bonding
YAG welding
Hermetic packaging design
High Frequency packaging design compatible with high bit-rate signals up to 50Gb/s
Sub-micron precision mechanical assembly
Consideration of environmental stress factors for reliability (mechanical, thermal, humidity, …)
Standardized reliability testing
Critical processes such as coupling light coming from laser chips into fibers using filters, optical isolators, lenses and Fiber Bragg Grating filters are also mastered.