PACKAGING

3SP Technologies has a renowned experience in high quality packaging design that requires seven areas of expertise:

Eutectic & glue bonding

YAG welding

Hermetic packaging design

High Frequency packaging design compatible with high bit-rate signals up to 50Gb/s

Sub-micron precision mechanical assembly

Consideration of environmental stress factors for reliability (mechanical, thermal, humidity, …)

Standardized reliability testing

Critical processes such as coupling light coming from laser chips into fibers using filters, optical isolators, lenses and Fiber Bragg Grating filters are also mastered.