Strong technical experience

More than 25 years expertise in optoelectronic chips & components design and manufacturing

Recognized product performances and reliability (lab & field data)

Complete and up-to-date equipment set and processes

Unique reliability proven “building block” approach

Broad “chips, CoS & packaged devices” product offering

Scalable production capacity

Technical customization, customer support and accountability

Stable business relationship

Fully deployed since 1994 and fully production stabilized

MOVPE & GS-MBE reactors

Wet oxidation

Dry (RIE, IBE, RIBE, ICP) & Wet etching

Dielectric PECVD

DIBS & e-beam metal deposition

UV & holographic Photo-lithography

UHV passivation

E-beam & IBD facet coating

Automatic wafer, bar & chip probe testing

Automatic eutectic die bonding & wiring

Automatic chip on submount testing benches & burn-in racks